CEA-LETI participated at the Electronic Components and Technology Conference (ECTC) in Orlando, Florida

From May 30 to June 2, 2023 in Orlando, Florida, CEA-LETI attended the Electronic Components and Technology Conference (ECTC), the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. The 73rd ECTC attracted more than 1,500 attendees from around the world. 

CEA-LETI was able to showcase its latest 3D and packaging achievements for power electronics, high performance computing, RF and imagers applications at its booth 234. It also presented several demonstrators, including the TINKER project’s demonstrator, a mobile LiDAR 256-channel beam steering device designed for autonomous driving applications.  

CEA-LETI is especially honored to receive the Outstanding Interactive Presentation Paper award for its presentation on Advanced 3D Integration TSV and Flip Chip Technologies Evaluation for the Packaging of a Mobile LiDAR 256-Channel Beam Steering Device Designed for Autonomous Driving Application. The paper describes the development and evaluation of a novel packaging solution based on through-silicon vias (TSVs) and flip-chip technologies for the integration of a high-density optical-phased array (OPA) chip with a silicon interposer and a readout integrated circuit (ROIC). Congratulations to T. Mourier and his co-authors! 

For more information about their experience, please visit CEA-LETI website and social media!